CAQN-CX
Purchasing Information Flowdown (AS9100)
IPC J-STD-001D, Class 3 (Requirements for Soldering Electrical and Electronic Assemblies) with the modifications listed below is a requirement of this purchase order.
Note: This Quality Note is NOT intended to apply to Component Parts or Component Assemblies subject to soldering at a higher level of assembly where reflow could take place. It is understood that High Temperature Solders are appropriate and required to prevent solder reflow at a higher level of assembly.
- Solder alloys, such as Sn60Pb40, Sn62Pb36Ag2, and Sn63Pb37, shall be in accordance with J-STD-006. Other solder alloys shall not be used for electrical and electronic assembly soldering unless otherwise specified on the drawing or purchase order. (Reference J-STD-001D Para. 3.2)
- Process Validation and control cannot be substituted for 100% X-Ray inspection of Ball Grid Arrays (BGAs) unless it is part of a documented process control program agreed to by the Clear Align procuring agency. (Reference J-STD-001 Para. 7.6.14).
- Supplier will comply with J-STF-001D Paragraph 9.1.10 Measles, unless the Printed Circuit Board (PCB) is procured to a specification in which a greater level of measling is acceptable, such as IPC-6012 and IPC-6013, then the assemblies will use the criteria called out therein. Measling should be identified as a Process Indicator as defined in J-STD-001D Paragraph 1.5.1.
Compliance to the requirements of this standard is subject to Clear Align review at any time during the performance of this order.
Purchasing Information Flowdown (AS9100)