CAQN-JW

Solderable Termination Finishes (No Pure Tin)

 

Components and components in completed subassemblies furnished under this Purchase Order shall not be received with any of the Non-Approved termination finishes listed below. The termination finish shall meet the solderability requirements of ANSI/J-STD-002 or EIA JESD22-B102 as a minimum and must accept solder at 200 degrees Celsius or less. ANSI/J-STD-002 is the preferred test method. A double tinning or dynamic solder wave process shall be used for any gold plating removal - Nickel Palladium Gold (gold flash and Electroless Nickel Immersion Gold (ENIG) are acceptable
Non-Approved Termination Finishes: Any solder containing tin (Sn) that does not contain at least 3% lead (Pb). This includes, but not limited to:

  • Pure tin (Sn)
  • Tin-Bismuth (SnBi)
  • Tin-Silver-Copper (SnAgCu a.k.a. SAC105, 305, 405 and all other variations)
  • Tin-Silver (SnAg)

Gold that is:

  • Greater than 0.4 μm [15.7 microinches] thick on a surface mount part
  • Greater than 2.5 μm [98.4 microinches] thick on a thru-hole part

Exception: Tin-Silver (SnAg) and Tin Antimony (SnSb) may be approved for use in high temperature solder applications.

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Clear Align is a preeminent global technology company specializing in AI-enabled and networked Electro-Optical/Infrared (EO/IR) systems for Border Surveillance, Counter UAS, Ground Vehicle targeting, Airborne ISR and Space imaging. Our design capabilities include opto-mechanical, electro-optical, FPGA and software. We offer in-house optical fabrication, optical coatings, opto-mechanical assembly, sensor integration, video processing and AI enabled ATR. Clear Align offers a market leading range of high-definition MWIR thermal imaging cameras that are integrated with a wide range of platforms. We specialize in custom integration with all C2 platforms to deliver a completely bespoke solution.

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Corporate Headquarters:
2550 Boulevard of the Generals,
Suite 280
Eagleville, PA 19403

M: info@clearalign.com