CAQN-JW
Solderable Termination Finishes (No Pure Tin)
Components and components in completed subassemblies furnished under this Purchase Order shall not be received with any of the Non-Approved termination finishes listed below. The termination finish shall meet the solderability requirements of ANSI/J-STD-002 or EIA JESD22-B102 as a minimum and must accept solder at 200 degrees Celsius or less. ANSI/J-STD-002 is the preferred test method. A double tinning or dynamic solder wave process shall be used for any gold plating removal - Nickel Palladium Gold (gold flash and Electroless Nickel Immersion Gold (ENIG) are acceptable
Non-Approved Termination Finishes: Any solder containing tin (Sn) that does not contain at least 3% lead (Pb). This includes, but not limited to:
- Pure tin (Sn)
- Tin-Bismuth (SnBi)
- Tin-Silver-Copper (SnAgCu a.k.a. SAC105, 305, 405 and all other variations)
- Tin-Silver (SnAg)
Gold that is:
- Greater than 0.4 μm [15.7 microinches] thick on a surface mount part
- Greater than 2.5 μm [98.4 microinches] thick on a thru-hole part
Exception: Tin-Silver (SnAg) and Tin Antimony (SnSb) may be approved for use in high temperature solder applications.