CAQN HT

Micro-section Coupon

1. Micro-section and Coupon Requirements:
   With each delivery of boards or flex circuits except Type 1 (single sided) and Type 2 (double sided) the supplier shall include the micro-sections used for product acceptance and coupon strips representing each panel for which product is delivered. Supplier will conform to all Military and Industry specifications referenced on the procurement documents associated with this procurement. The following standard IPC micro-sections for each panel will consist of (as a minimum):
   1. “A and B” micro-sections from opposite corners of the panel that have not been solder floated (As Received).
   2. The following micro-sections are required in the “X” and “Y” direction from opposite corners of the panel:
      1. “A” micro-sections that have been solder floated. (Note: This is only required if the hole size is larger than the hole on the “B” micro-section. The larger hole will be used to detect post separation.)
      2. “B” microsections that have been solder floated.
   3. If the supplier uses the “A/B” micro-sections then the following are required:
      1. “A/B” micro-sections from opposite corners of the panel that have not been solder floated (As received).
      2. “A/B” micro-sections from opposite corners of the panel that have not been solder floated (As received).
      3. Coupon strips representing the micro-sections in paragraphs 1, 2 or 3, 4 above.
      4. If the board contains blind or buried vias, one set of micro-sections representing these features must be submitted.
      5. Any special coupon strips (impedance, peel strength, wire bond, etc.) That are specified on the master drawing. The coupon strips and micro-sections listed above will not be returned to the supplier. The supplier shall retain other acceptance micro-sections and additional coupon strips that are a part of the fabrication panel.
2. Documentation Requirements:
   1. C of C stating conformance to the specifications
   2. A list of the panel numbers and corresponding boards shipped. Also, indicate which panels were scrapped at your facility.
   3. Electrical test results to include impedance data if applicable.
   4. Statement of results of “R” coupon testing by panel number if used to verify acceptable internal layer registration. Use of a “modified F” coupon is acceptable in some cases if it is used for the same purpose as the “R” coupon.
   5. If the printed circuit board micro-section fails external annular ring, state that the boards themselves were checked for registration and pass, if the boards are to be delivered.
3. Retention Requirements:
   The supplier is responsible for maintaining a set of micro-sections and coupon strips which represent the product delivered. However, if only one set remains and, in order to satisfy the requirements of this Q-Note, that set is delivered to Clear Align then Clear Align accepts the responsibility for the micro-sections and coupon strips and their retention as required by the applicable Military specification.

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