CAQN-HU
Components and components in completed subassemblies furnished under this Purchase Order shall be delivered with one of the approved termination finishes as listed below. The termination finish shall be capable of meeting the solderability requirements of ANSI/J-STD-002 or EIA/JESD22-B102 as a minimum. ANSI/J-STD-002 is the preferred test method. When required, a double tinning or dynamic solder wave process shall be used for any gold plating removal.
Approved Termination Finishes:
- Tin-Lead (Sn-Pb) with minimum 3% Pb
- Palladium plated
- Nickel palladium gold (gold flash)
- Electroless Nickel Immersion Gold (ENIG)
- Gold 0.4 μm [15.7 microinches] or less on a surface mount part
- Gold 2.5 μm [98.4 microinches] or less on a thru-hole part
- Pb-free tin that is either:
- Matte finish over a nickel barrier
- Matte finish that has been annealed
- Hot dipped over nickel barrier
- Pb-free tin is defined as any finish containing tin which does not contain at least 3% Pb – this includes pure Sn, SnAgCu, SnAg and SnBi (Bi content can not exceed 5%)
- All other pure tin finishes are disallowed unless authorized by the procuring agency